SWT-125/150 Solder Sleeve Device Shield Termination Without Leads
Product Description
The SWT-125/150 Solder Sleeve Device is specially designed for wire connection, welding, heat shrink protection, and waterproofing at one time. It features various specifications with different shrink ratios and operating temperatures.
Key Features:
SWT-125
• Shrink Ratio: 2:1
• Non-Flame Retardant
• Operating Temperature: -55°C to +125°C
• Initial Shrink Temperature: 85°C
• Solder Initial Melting Temperature: 138°C
• Solder Fully Melting Temperature: 160°C
SWT-150
• Shrink Ratio: 2:1
• Flame Retardant
• Operating Temperature: -55°C to +150°C
• Initial Shrink Temperature: 135°C
• Solder Initial Melting Temperature: 158°C
• Solder Fully Melting Temperature: 180°C
• Hot Melt Glue Colors: Refer to the chart for reference
• Other Colors: Available upon request
Technical Data:
• Tensile Strength (MPa): ≥ 10.3 (ASTM D638)
• Elongation (%): ≥ 200 (ASTM D638)
• Withstand Voltage (V): 2500V, 5s, Pass (ASTM D149)
• Breakdown Strength (kV/mm): ≥ 19.7 (ASTM D149)
• Volume Resistivity (Ω·cm): ≥ 10¹(IEC 93)
• Corrosion Resistance: Pass (ASTM D2671)
Specification Chart:
SWT-125
• Various part numbers with different internal diameters (I.D.), lengths, conductor sizes, and recommended cable ranges. Standard colors and minimum package quantities are specified for each part number.
SWT-150
• Various part numbers with different internal diameters (I.D.), lengths, conductor sizes, and recommended cable ranges. Standard colors and minimum package quantities are specified for each part number.
Compliance and Certifications:
The product complies with RoHS standards, ensuring safety and reliability.
Applications:
Ideal for wire connection, welding, heat shrink protection, and waterproofing applications due to its specific shrink ratios, temperature ranges, and solder melting points.
For further customization or detailed specifications, please contact the supplier directly.
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