HSS63-150 Solder Sleeve Device Shield Termination With Leads
Product Description
The HSS63-150 Solder Sleeve Device is suitable for shielding and grounding terminal processing, providing reliable protection. The embedded lead wire is convenient for installation.
Key Features:
• Shrink Ratio: 2:1
• Flame Retardant
• High Temperature Resistance, Corrosion Resistance, External Friction Resistance: Good sealing
• Clear Heat Shrink Tubing: Provides precise viewing
• Operating Temperature:
• Initial Shrink Temperature: 135°C
• Solder Initial Melting Temperature: 158°C
• Solder Fully Melting Temperature: 180°C
• Multi-Color Hot Melt Adhesive
Technical Data:
• Tensile Strength (MPa): ≥ 10.3 (ASTM D638)
• Elongation (%): ≥ 200 (ASTM D638)
• Withstand Voltage (V): 2500V, 60s, Pass (ASTM D149)
• Breakdown Strength (kV/mm): ≥ 19.7 (ASTM D149)
• Volume Resistivity (Ω·cm): ≥ 10^14 (IEC 93)
• Corrosion Resistance: Pass (ASTM D2671)
• Pulling Force (N): ≥ 113 (JB/T13395)
Specification Chart:
• Various part numbers with different internal diameters (I.D.), lengths, hot melt adhesive ring sizes, solder ring sizes, and shielded wire lengths. Standard colors and minimum package quantities are specified for each part number.
Compliance and Certifications:
The product complies with RoHS standards, ensuring safety and reliability.
Applications:
Ideal for shielding and grounding terminal processing due to its shrink ratios, temperature ranges, and solder melting points.
For further customization or detailed specifications, please contact the supplier directly.
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